Today is the last day to submit your entry to The Dieline Awards, celebrating the world's best package design. The competition is presented by The Dieline, directory and blog for the package design industry, in collaboration with the Fuse conference . There are over 30 prizes to be won, and all winners will be showcased in Chicago this April.
Undoubtedly, many of you have winning package designs floating around on your hard drive, so package it up and send it in!
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